Optical image stabilization system, imaging device, and electronic device

ABSTRACT

An optical image stabilization system, an imaging device, and an electronic device are provided. The optical image stabilization system includes a micro electro-mechanical system (MEMS), and an image sensor. The MEMS includes a fixed electrode, a movable electrode, and a deformable connection member. The movable electrode cooperates with the fixed electrode. The deformable connection member is configured to fixedly connect the fixed electrode with the movable electrode. The image sensor is fixedly connected to the movable electrode. The fixed electrode and the movable electrode are configured to generate an electrostatic force under a driving voltage. The deformable connection member is configured to deform under the electrostatic force in a direction where the movable electrode moves, to make the movable electrode move, so as to drive the image sensor to move.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/196,704, filed Nov. 20, 2018, which is a continuation ofInternational Application No. PCT/CN2017/084217, filed May 12, 2017,which claims priority to and benefits of Chinese Patent ApplicationSerial No. 201610616350.X, filed Jul. 29, 2016. The entire contents ofthe aforementioned applications are incorporated herein by reference.

FIELD

The present disclosure relates to the field of an optical imagestabilization technology, and more particularly to an optical imagestabilization system, an imaging device and an electronic device.

BACKGROUND

In the existing optical image stabilization system, a voice coil motoris used as an actuator and usually has a large size, which isdisadvantageous for miniaturization of an imaging device and anelectronic device using the existing optical image stabilization system.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other aspects and advantages of embodiments of the presentdisclosure will become apparent and more readily appreciated from thefollowing descriptions made with reference to the drawings, in which:

FIG. 1 is a schematic view of an optical image stabilization systemaccording to an embodiment of the present disclosure.

FIG. 2 is a schematic view of an electronic device according to anembodiment of the present disclosure.

FIG. 3 is a schematic view of a connection member according to anembodiment of the present disclosure.

FIG. 4 is a graph showing a force-deformation characteristic curve of aconnection member according to an embodiment of the present disclosure.

FIG. 5 is a schematic view of a micro electro-mechanical systemaccording to another embodiment of the present disclosure.

FIG. 6 is a schematic view of an optical image stabilization systemaccording to another embodiment of the present disclosure.

FIG. 7 is a block diagram of an imaging device according to anembodiment of the present disclosure.

REFERENCE NUMERALS

optical image stabilization system 10, inner frame 11, inner frame pad112, MEMS 12, fixed electrode 122, upper surface 1222, first pad 1224,fourth pad 1226, movable electrode 124, upper surface 1242, second pad1244, via hole 1246, connection member 126, deformable wire 1262,connection tab 1264, first pair X1, second pair Y1, third pair X2,fourth pair Y2, outer frame 13, outer frame pad 132, image sensor 14,upper surface 142, fifth pad 144, circuit board 16, groove 161, uppersurface 162, annular through recess 163, third pad 164, movable part165, first wire 166, fixed part 167, second wire 168, conductive paste169, reinforcing plate 18, imaging device 20, electronic device 30, lensassembly 40, display 50, housing 60.

DETAILED DESCRIPTION

Embodiments of the present disclosure are described in detail below,examples of which are illustrated in the drawings. The same or similarelements are denoted by same reference numerals in different drawingsunless indicated otherwise. The embodiments described herein withreference to drawings are explanatory, and used to generally understandthe present disclosure. The embodiments shall not be construed to limitthe present disclosure.

In the specification, it is to be understood that terms such as“central”, “longitudinal”, “lateral”, “length”, “width”, “thickness”,“upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”,“horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise” and“counterclockwise”, should be construed to refer to the orientation asthen described or as shown in the drawings under discussion. Theserelative terms are for convenience of description and do not requirethat the present invention be constructed or operated in a particularorientation, and thus shall not be construed to limit the presentdisclosure. In addition, it should be understood that terms such as“first” and “second” are used herein for purposes of description and arenot intended to indicate or imply relative importance or significance orto imply the number of indicated technical features. Therefore, thefeature defined with “first” and “second” may include one or more ofthis feature. In the description of the present disclosure, unlessspecified otherwise, “a plurality of” means two or more than two, suchas two or three.

In the present disclosure, unless specified or limited otherwise, theterms “mounted”, “connected” and “coupled” and the like are usedbroadly, and may be, for example, fixed connections, detachableconnections, or integral connections; may also be mechanical orelectrical connections; may also be direct connections or indirectconnections via intervening structures; may also be inner communicationsor inner interactions of two elements. Specific meanings of the aboveterms in the present disclosure can be understood by those skilled inthe art according to specific conditions.

In the present invention, unless specified or limited otherwise, astructure in which a first feature is “on” or “below” a second featuremay include an embodiment in which the first feature is in directcontact with the second feature, and may also include an embodiment inwhich the first feature and the second feature are not in direct contactwith each other, but are contacted via an additional feature formedtherebetween. Furthermore, a first feature “on,” “above,” or “on top of”a second feature may include an embodiment in which the first feature isright or obliquely “on,” “above,” or “on top of” the second feature, orjust means that the first feature is at a height higher than that of thesecond feature; while a first feature “below,” “under,” or “on bottomof” a second feature may include an embodiment in which the firstfeature is right or obliquely “below,” “under,” or “on bottom of” thesecond feature, or just means that the first feature is at a heightlower than that of the second feature.

Various embodiments and examples are provided in the followingdescription to implement different structures of the present disclosure.In order to simplify the present disclosure, certain elements andsettings will be described. However, these elements and settings areonly by way of example and are not intended to limit the presentdisclosure. In addition, reference numerals and/or reference letters maybe repeated in different examples in the present disclosure. Thisrepeating is for the purpose of simplification and clarity and does notrefer to relations between different embodiments and/or settings.Furthermore, examples of different processes and materials are providedin the present disclosure. However, it would be appreciated by thoseskilled in the art that other processes and/or materials may be alsoapplied.

As shown in FIG. 1, an optical image stabilization system 10 accordingto an embodiment of the present disclosure includes a microelectro-mechanical system (MEMS) 12 and an image sensor 14. The MEMS 12includes a fixed electrode 122, a movable electrode 124, and adeformable connection member 126. The movable electrode 124 cooperateswith the fixed electrode 122. The deformable connection member 126 isconfigured to fixedly connect the fixed electrode 122 with the movableelectrode 124. The fixed electrode 122 and the movable electrode 124 areconfigured to generate an electrostatic force under a driving voltage.The deformable connection member 126 is configured to deform under theelectrostatic force in a direction where the movable electrode 124moves, to make the movable electrode 124 move, so as to drive the imagesensor 14 to move to compensate for a jitter.

The jitter refers to a jitter that occurs during an exposure process inusing the electronic device 30 to take pictures, which causes blurringof an image output by the imaging device 20. The imaging quality of theimaging device 20 may be improved by using the optical imagestabilization system 10.

The MEMS is a high-tech electromechanical device developed from themicroelectronics technology (the semiconductor manufacturing technology)combining photoetching, corroding, thin film forming, LIGA (LIGA is anabbreviation for German words of lithographie, galvanoformung andabformung indicating lithography, electroforming and impressing,respectively), silicon micromachining, non-silicon micromachining, andprecision machining technologies, and has a smaller size when comparedwith the existing voice coil motor, which is advantageous for theminiaturization of the optical image stabilization system 10.

For example, in some embodiments of the present disclosure, the MEMS 12has a size of 8.5 mm*8.5 mm or less in a lateral dimension. Moreover,with the development of the semiconductor manufacturing technology, thesize of the MEMS 12 may be smaller.

Therefore, compared with the existing voice coil motor, the MEMS 12 hasa size in a millimeter level or lower, and thus has a significantadvantage in size.

With reference to FIG. 2, the optical image stabilization system 10according to the embodiments of the present disclosure may be applied tothe imaging device 20 according to the embodiments of the presentdisclosure, and the imaging device 20 according to the embodiments ofthe present disclosure may be applied to an electronic device 30according to the embodiments of the present disclosure. In someembodiments of the present disclosure, the imaging device 20 includesthe optical image stabilization system 10 described above and a lensassembly 40 coupled to the optical image stabilization system 10. Insome embodiments of the present disclosure, the electronic device 30includes a housing 60, a display 50 connected with the housing and theimaging device 20 disposed in the housing 60. For example, theelectronic device 30 according to the embodiments of the presentdisclosure may be a mobile phone or a tablet computer, and the imagingdevice 20 according to the embodiments of the present disclosure may bea front camera or a rear camera of a mobile phone or a tablet computer.

Moreover, by using the optical image stabilization system 10 accordingto the embodiments of the present disclosure, the imaging device 20 andthe electronic device 30 according to the embodiments of the presentdisclosure may be advantageously miniaturized.

In addition, due to an electrostatic force actuation (i.e., an actuationbased on an attraction among electrostatic charges), on one hand, theMEMS 12 has a less power consumption when compared with the existingvoice coil motor, for example, in some embodiments of the presentdisclosure, the power consumption of the MEMS 12 is less than 10 mW, onthe other hand, the MEMS 12 has a low heat generation and thus having noproblem of heat dissipation.

In some embodiments of the present disclosure, by performing thin filmforming, photoetching, corroding, laser cutting, silicon micromachining,non-silicon micromachining and precision machining technologies on asilicon substrate (not shown), the fixed electrode 122 and the movableelectrode 124 may be formed, and the movable electrode 124 is floatingand is connected with the fixed electrode 122 by the connection member126.

In some embodiments of the present disclosure, the MEMS 12 includes aplurality of pairs of the fixed electrodes 122 and the movableelectrodes 124, and each pair of the fixed electrode 122 and the movableelectrode 124 is configured to drive the image sensor 14 to move in apredetermined direction in a same plane.

In this way, the plurality of pairs of the fixed electrodes 122 and themovable electrodes 124 may compensate for jitters in differentdirections. Moreover, a plurality of pairs of the fixed electrodes 122and the movable electrodes 124 may cooperate with each other in the sameplane, that is, a plurality of pairs of the fixed electrodes 122 and themovable electrodes 124 may be in the same plane. Therefore, the MEMS 12may have a single-layer electrode structure, which can simplify thestructure of the MEMS 12, thus making the MEMS 12 simple in structureand easy to manufacture.

In some embodiments of the present disclosure, the connection member 126may also be formed by performing thin film forming, photoetching,corroding, laser cutting, silicon micromachining, non-siliconmicromachining and precision machining technologies on a siliconsubstrate (not shown).

With reference to FIG. 3, in some embodiments of the present disclosure,the connection member 126 includes a deformable wire 1262 and a pair ofconnection tabs 1264 connected to both ends of the deformable wire 1262respectively.

In this way, good mechanical connection and deformation characteristicsmay be provided by the deformable wire 1262, and the connection tab 1264may be used to increase the connection area with the fixed electrode 122or the movable electrode 124, thus improving the connection strength.

In some embodiments of the present disclosure, the deformable wire 1262may be a silicon wire.

In this way, the deformable wire 1262 may be manufactured by thesemiconductor manufacturing technology.

In some embodiments of the present disclosure, the shape and the size ofthe deformable wire 1262 may be determined according to materialproperties, such that the movable electrode 124 may be suspended by thedeformable wire 1262 to the fixed electrode 122 and the deformable wire1262 may deform in the moving direction of the movable electrode 124.

For example, in some embodiments of the present disclosure, thedeformable wire 1262 is the silicon wire and has a rectangularcross-section, a width of 10 to 30 μm, a thickness of 1 to 3 μm, and alength of 500 to 800 μm. A width direction of the deformable wire 1262is perpendicular to the moving direction of the movable electrode 124when the deformable wire 1262 is configured to connect the fixedelectrode 122 with the movable electrode 124.

As an example, the deformable wire 1262 has a width of 25 μm, athickness of 1.5 μm, and a length of 600 μm.

With reference to FIG. 4, in settings of the shape and the size, thedeformable wire 1262 may be deformed only in the moving direction of themovable electrode 124 under an external force, and the deformation ofthe deformable wire 1262 is proportional to the external force within acertain external force range (i.e., the external force is smaller than apredetermined threshold). The deformable wire 1262 remains rigid and isnot easy to deform in other directions. On this basis, when theelectrostatic force F is smaller than the predetermined threshold, thedeformation D (horizontal axis) of the deformable wire 1262 in themoving direction of the movable electrode 124 under the electrostaticforce F is proportional to the electrostatic force F (vertical axis).

In this way, by precisely controlling the driving voltage, the MEMS 12has a very high moving accuracy when compared with the existing voicecoil motor, and the accuracy may be in a pixel level (i.e., a distanceaccuracy of movement of the image sensor 14 driven by the MEMS 12 foreach time may be equivalent to a pixel of the image sensor 14).

In some embodiments of the present disclosure, when the electrostaticforce F is smaller than a predetermined threshold, an adjustment valuebetween two adjacent electrostatic forces may result in a deformation D(i.e., a change in amplitude) smaller than or equal to 150 μm.

In other words, the MEMS 12 may drive the image sensor 14 to move 150that is, a compensation capability/range of the optical imagestabilization system 10 may be 150 μm (in compensation accuracy), andthe MEMS 12 has a strong compensation ability when compared with theexisting voice coil motor.

In addition, the MEMS 12 may have a higher mechanical frequency due toapplications of the materials, shapes and sizes of the aboveembodiments. For example, in some embodiments of the present disclosure,the mechanical frequency of the MEMS 12 is typically between 80 to 120Hz, such as 100 Hz. Therefore, due to the high mechanical frequency, theMEMS 12 may be less sensitive to sound or vibration when compared withthe mechanical frequency (about 20 Hz) of the existing voice coil motor.

In some embodiments of the present disclosure, a plurality of first pads1224 are formed on an upper surface 1222 of the fixed electrode 122, anda plurality of second pads 1244 are formed on an upper surface 1242 ofthe movable electrode 124. A plurality of the deformable connectionmembers 126 exist, and the connection tabs 1264 are fixedly connectedwith the first pad 1224 and the second pad 1244 respectively such thateach deformable connection member 126 is configured to fixedly connectthe fixed electrode 122 with the movable electrode 124.

In some embodiments of the present disclosure, a plurality of the firstpads 1224 may be formed on the fixed electrode 122 and a plurality ofthe second pads 1244 may be formed on the movable electrode 124 by thepenetration and photolithography process, and the connection tabs 1264are fixedly connected with the first pad 1224 and the second pad 1244respectively in a wire bonding manner. In this way, it may be ensuredthat the connection member 126 is fixedly connected with the fixedelectrode 122 and the movable electrode 124 respectively. Moreover,since the fixed electrode 122 and the movable electrode 124 are fixedlyconnected by a plurality of connection members 126, that is, there areredundant connections. In this way, even if some of the connectionmembers 126 are broken, the fixed electrode 122 and the movableelectrode 124 may still be fixedly connected via the remainingconnection members 126.

In some embodiments of the present disclosure, the image sensor 14 maybe fixed to the movable electrode 124 by glue.

In this way, the process is simple, thus facilitating the manufacture.

In some embodiments of the present disclosure, the optical imagestabilization system 10 includes a circuit board 16, and the fixedelectrode 122 is disposed on the circuit board 16. A plurality of thirdpads 164 are formed on an upper surface 162 of the circuit board 16. Aplurality of fourth pads 1226 are formed on an upper surface 1222 of thefixed electrode 122. A plurality of the third pads 164 are connected toa plurality of the fourth pads 1226 via first wires 166. The drivingvoltage is applied to the fixed electrode 122 from the circuit board 16through the first wires 166 and applied to the movable electrode 124from the circuit board 16 through the first wires 166 and some of theconnection members 126.

In this way, some of the connection members 126 are configured totransmit the driving voltage to the fixed electrode 122 and the movableelectrode 124. The connection member 126 is not only functioned as amechanical connection, but also can realize an electrical connection,thus realizing two functions at the same time, which may simplify thestructure, reduce the amount of components and reduce cost.

A plurality of fifth pads 144 are formed on an upper surface 142 of theimage sensor 14, a plurality of fifth pads 144 are connected to some ofthe second pads 1244 via second wires 168. The circuit board 16 iselectrically connected to the image sensor 14 via the first wires 166,some of the connection members 126, and the second wires 168.

In this way, some of the connection members 126 are configured totransmit control signals and image signals. The connection member 126 isnot only functioned as a mechanical connection, but also can realize anelectrical connection, thus realizing two functions at the same time,which may simplify the structure, reduce the amount of components andreduce cost.

In some embodiments of the present disclosure, the circuit board 16 is aflexible circuit board. The optical image stabilization system 10further includes a reinforcing plate 18 attached to a surface of thecircuit board 16 opposite to the MEMS 12. The reinforcing plate 18 isconfigured to increase the mechanical strength of the circuit board 16.

Alternatively, in other embodiments of the present disclosure, thecircuit board 16 may not be limited to the embodiments described above,and may be a rigid circuit board.

In some embodiments of the present disclosure, a groove 161 is definedin the circuit board 16, and the MEMS 12 and the image sensor 14 aredisposed in the groove 161.

In this way, the whole height of the optical image stabilization system10 may be reduced, which is advantage for miniaturization.

In some embodiments of the present disclosure, the fixed electrode 122is fixed on the circuit board 16 by glue.

In this way, the process is simple, thus facilitating the manufacture.

In some embodiments of the present disclosure, an annular through recess163 is defined in the circuit board 16 and separates the circuit board16 into a movable part 165, and a fixed part 167 surrounding the movablepart 165, in which the fixed electrode 122 is disposed on the fixed part167 and the movable electrode 124 is disposed on the movable part 165.

In this way, the movable electrode 124 is able to move while beingfixedly connected to the circuit board 16.

The movable electrode 124 may also be fixed to the movable part 165 byglue.

In some embodiments of the present disclosure, a via hole 1246 isdefined in the movable electrode 124, and the image sensor 14 iselectrically connected to the movable part 165 via a conductive pastelayer 169 filled in the via hole 1246.

With reference to FIGS. 5 and 6, in some embodiments of the presentdisclosure, the fixed electrode 122 and the movable electrode 124 arepectinate electrodes cooperating with each other.

When the pectinate electrode is applied, the cooperating area betweenthe fixed electrode 122 and the movable electrode 124 is increased, andthe driving voltage is converted into the electrostatic force with ahigh efficiency, which may further reduce the power consumption of theoptical image stabilization system 10.

A first pair X1 of the fixed electrode 122 and the movable electrode124, a second pair Y1 of the fixed electrode 122 and the movableelectrode 124, a third pair X2 of the fixed electrode 122 and themovable electrode 124 and a fourth pair Y2 of the fixed electrode 122and the movable electrode 124 exist, the first pair X1, the second pairY1, the third pair X2 and the fourth pair Y2 are distributed in a shapeof a Chinese character “

”, the first pair X1 and the third pair X2 are configured to drive theimage sensor 14 to move in a first direction (for example, an Xdirection) respectively, and the second pair Y1 and the fourth pair Y2are configured to simultaneously drive the image sensor 14 to move in asecond direction (for example, a Y direction) perpendicular to the firstdirection (for example, the X direction).

In this way, a motion compensation may be realized in the firstdirection (for example, the X direction) and the second direction (forexample, the Y direction), and by controlling the first pair X1 and thethird pair X2 to drive the image sensor 14 to move in oppositedirections, a rotation compensation may be realized in a third direction(for example, a Z direction) perpendicular to the first direction (forexample, the X direction) and the second direction (for example, the Ydirection).

In some embodiments of the present disclosure, the MEMS 12 furtherincludes an inner frame 11 and an outer frame 13. The inner frame 11 isfixedly connected to the fixed electrodes 122 of the first pair X1, thesecond pair Y1, the third pair X2 and the fourth pair Y2. The outerframe 13 is fixedly connected to the movable electrodes 124 of the firstpair X1, the second pair Y1, the third pair X2 and the fourth pair Y2.The deformable connection member 126 is configured to fixedly connectthe fixed electrode 122 with the movable electrode 124 by fixedlyconnecting the inner frame 11 with the outer frame 13.

In this way, the process is simple, thus facilitating the manufacture.

In some embodiments of the present disclosure, the inner frame 11 andthe outer frame 13 both have a substantially rectangular shape, and aninner frame pad 112 is formed on an upper surface of the inner frame 11and an outer frame pad 132 is formed on an upper surface of the outerframe 13.

The connection member 126 is configured to fixedly connect the innerframe 11 with the outer frame 13 by being fixedly disposed on the innerframe pad 112 and the outer frame pad 132.

In this way, the process is simple, thus facilitating for manufacture.

Reference throughout this specification to “an embodiment”, “someembodiments”, “an example”, “a specific example”, or “some examples”means that a particular feature, structure, material, or characteristicdescribed in connection with the embodiment or example is included in atleast one embodiment or example of the present disclosure. Theappearances of above phrases in various places throughout thisspecification are not necessarily referring to the same embodiment orexample of the present disclosure. Furthermore, the particular features,structures, materials, or characteristics may be combined in anysuitable manner in one or more embodiments or examples. Althoughexplanatory embodiments have been shown and described above, it would beappreciated by those skilled in the art that the above embodimentscannot be construed to limit the present disclosure, and changes,alternatives, and modifications can be made in the embodiments withoutdeparting from spirit, principles and scope of the present disclosure.

What is claimed is:
 1. An optical image stabilization system,comprising: a micro electro-mechanical system comprising: a fixedelectrode; a movable electrode cooperating with the fixed electrode; anda deformable connection member for fixedly connecting the fixedelectrode with the movable electrode, wherein the movable electrode isfloating to and connected with the fixed electrode by the connectionmember; and an image sensor fixedly connected to the movable electrode;wherein the fixed electrode and the movable electrode are configured togenerate an electrostatic force under a driving voltage, the deformableconnection member is configured to deform under the electrostatic forcein a direction where the movable electrode moves, to make the movableelectrode move, so as to drive the image sensor to move to compensatefor a jitter; the deformable connection member comprises a deformablewire and connection tabs connected to both ends of the deformable wirerespectively, a plurality of first pads formed on an upper surface ofthe fixed electrode, and a plurality of second pads are formed on anupper surface of the movable electrode; a plurality of the deformableconnection members exist, and the connection tabs are fixedly connectedwith the first pad and the second pad respectively such that eachdeformable connection member is configured to fixedly connect the fixedelectrode with the movable electrode; wherein the optical imagestabilization system further comprises a circuit board, and the fixedelectrode is disposed on the circuit board; a plurality of third padsare formed on an upper surface of the circuit board; a plurality offourth pads are formed on an upper surface of the fixed electrode; theplurality of the third pads are connected to the plurality of the fourthpads via first wires; the driving voltage is applied to the fixedelectrode from the circuit board through the first wires and applied tothe movable electrode from the circuit board through the first wires andsome of the connection members; a plurality of fifth pads are formed onan upper surface of the image sensor, the plurality of fifth pads areconnected to some of the second pads via second wires, and the circuitboard is electrically connected to the image sensor via the first wires,some of the connection members and the second wires; the circuit boardis a flexible circuit board, the optical image stabilization systemfurther includes a reinforcing plate attached to a surface of thecircuit board opposite to the micro electro-mechanical system.
 2. Theoptical image stabilization system according to claim 1, wherein a sizeof the micro electro-mechanical system is smaller than or equal to 8.5mm*8.5 mm.
 3. The optical image stabilization system according to claim1, wherein a power consumption of the micro electro-mechanical system issmaller than 10 mW.
 4. The optical image stabilization system accordingto claim 1, wherein a mechanical frequency of the microelectro-mechanical system is in a range of 80 to 120 Hz.
 5. The opticalimage stabilization system according to claim 1, wherein the microelectro-mechanical system comprises a plurality of pairs of the fixedelectrodes and the movable electrodes, and the plurality of pairs of thefixed electrodes and the movable electrodes are configured to drive theimage sensor to move in different directions.
 6. The optical imagestabilization system according to claim 1, wherein the deformable wireis a silicon wire.
 7. The optical image stabilization system accordingto claim 6, wherein the deformable wire has a rectangular cross-section,a width of 10 to 30 μm, a thickness of 1 to 3 μm, and a length of 500 to800 μm; a width direction of the deformable wire is perpendicular to amoving direction of the movable electrode.
 8. The optical imagestabilization system according to claim 6, wherein a deformation of thedeformable wire in a moving direction of the movable electrode under theelectrostatic force is proportional to the electrostatic force when theelectrostatic force is smaller than a predetermined threshold.
 9. Theoptical image stabilization system according to claim 8, wherein thedeformation is smaller than or equal to 150 μm when the electrostaticforce is smaller than the predetermined threshold.
 10. The optical imagestabilization system according to claim 1, wherein a groove is definedin the circuit board, and the micro electro-mechanical system and theimage sensor are disposed in the groove.
 11. The optical imagestabilization system according to claim 10, wherein an annular throughrecess is defined in the circuit board and separates the circuit boardinto a movable part and a fixed part surrounding the movable part, inwhich the fixed electrode is disposed on the fixed part and the movableelectrode is disposed on the movable part.
 12. The optical imagestabilization system according to claim 11, wherein a via hole isdefined in the movable electrode, and the image sensor is electricallyconnected to the movable part via a conductive paste layer filled in thevia hole.
 13. The optical image stabilization system according to claim1, wherein the fixed electrode and the movable electrode are pectinateelectrodes cooperating with each other.
 14. The optical imagestabilization system according to claim 13, wherein the optical imagestabilization system comprises a first pair of the fixed electrode andthe movable electrode, a second pair of the fixed electrode and themovable electrode, a third pair of the fixed electrode and the movableelectrode, and a fourth pair of the fixed electrode and the movableelectrode, the first pair, the second pair, the third pair, and thefourth pair are distributed in a shape of a Chinese character “

”, the first pair and the third pair are configured to drive the imagesensor to move in a first direction respectively, and the second pairand the fourth pair are configured to simultaneously drive the imagesensor to move in a second direction perpendicular to the firstdirection.
 15. The optical image stabilization system according to claim14, wherein the first pair, the second pair, the third pair, and thefourth pair are further configured to drive the image sensor to rotatein a third direction perpendicular to both the first direction and thesecond direction by cooperating with each other.
 16. The optical imagestabilization system according to claim 14, wherein the microelectro-mechanical system further comprises: an inner frame fixedlyconnected to the fixed electrodes of the first pair, the second pair,the third pair, and the fourth pair; an outer frame fixedly connected tothe movable electrodes of the first pair, the second pair, the thirdpair, and the fourth pair; wherein the deformable connection member isconfigured to fixedly connect the fixed electrode with the movableelectrode by fixedly connecting the inner frame with the outer frame.17. The optical image stabilization system according to claim 16,wherein the inner frame and the outer frame both have a rectangularshape, and an inner frame pad is formed on an upper surface of the innerframe and an outer frame pad is formed on an upper surface of the outerframe; the connection member is configured to fixedly connect the innerframe with the outer frame by being fixedly disposed on the inner framepad and the outer frame pad.
 18. An imaging device, comprising anoptical image stabilization system, wherein the optical imagestabilization system comprises: a micro electro-mechanical systemcomprising: a fixed electrode; a movable electrode cooperating with thefixed electrode; and a deformable connection member for fixedlyconnecting the fixed electrode with the movable electrode, wherein themovable electrode is floating to and connected with the fixed electrodeby the connection member; and an image sensor fixedly connected to themovable electrode; wherein the fixed electrode and the movable electrodeare configured to generate an electrostatic force under a drivingvoltage, the deformable connection member is configured to deform underthe electrostatic force in a direction where the movable electrodemoves, to make the movable electrode move, so as to drive the imagesensor to move to compensate for a jitter; the deformable connectionmember comprises a deformable wire and connection tabs connected to bothends of the deformable wire respectively, a plurality of first padsformed on an upper surface of the fixed electrode, and a plurality ofsecond pads are formed on an upper surface of the movable electrode; aplurality of the deformable connection members exist, and the connectiontabs are fixedly connected with the first pad and the second padrespectively such that each deformable connection member is configuredto fixedly connect the fixed electrode with the movable electrode;wherein the optical image stabilization system further comprises acircuit board, and the fixed electrode is disposed on the circuit board;a plurality of third pads are formed on an upper surface of the circuitboard; a plurality of fourth pads are formed on an upper surface of thefixed electrode; the plurality of the third pads are connected to theplurality of the fourth pads via first wires; the driving voltage isapplied to the fixed electrode from the circuit board through the firstwires and applied to the movable electrode from the circuit boardthrough the first wires and some of the connection members; a pluralityof fifth pads are formed on an upper surface of the image sensor, theplurality of fifth pads are connected to some of the second pads viasecond wires, and the circuit board is electrically connected to theimage sensor via the first wires, some of the connection members and thesecond wires; the circuit board is a flexible circuit board, the opticalimage stabilization system further includes a reinforcing plate attachedto a surface of the circuit board opposite to the microelectro-mechanical system.
 19. An electronic device, comprising animaging device, wherein the imaging device comprises an optical imagestabilization system comprising: a micro electro-mechanical systemcomprising: a fixed electrode; a movable electrode cooperating with thefixed electrode; and a deformable connection member for fixedlyconnecting the fixed electrode with the movable electrode, wherein themovable electrode is floating to and connected with the fixed electrodeby the connection member; and an image sensor fixedly connected to themovable electrode; wherein the fixed electrode and the movable electrodeare configured to generate an electrostatic force under a drivingvoltage, the deformable connection member is configured to deform underthe electrostatic force in a direction where the movable electrodemoves, to make the movable electrode move, so as to drive the imagesensor to move to compensate for a jitter; the deformable connectionmember comprises a deformable wire and connection tabs connected to bothends of the deformable wire respectively, a plurality of first padsformed on an upper surface of the fixed electrode, and a plurality ofsecond pads are formed on an upper surface of the movable electrode; aplurality of the deformable connection members exist, and the connectiontabs are fixedly connected with the first pad and the second padrespectively such that each deformable connection member is configuredto fixedly connect the fixed electrode with the movable electrode;wherein the optical image stabilization system further comprises acircuit board, and the fixed electrode is disposed on the circuit board;a plurality of third pads are formed on an upper surface of the circuitboard; a plurality of fourth pads are formed on an upper surface of thefixed electrode; the plurality of the third pads are connected to theplurality of the fourth pads via first wires; the driving voltage isapplied to the fixed electrode from the circuit board through the firstwires and applied to the movable electrode from the circuit boardthrough the first wires and some of the connection members; a pluralityof fifth pads are formed on an upper surface of the image sensor, theplurality of fifth pads are connected to some of the second pads viasecond wires, and the circuit board is electrically connected to theimage sensor via the first wires, some of the connection members and thesecond wires; the circuit board is a flexible circuit board, the opticalimage stabilization system further includes a reinforcing plate attachedto a surface of the circuit board opposite to the microelectro-mechanical system.